Boson+ IQ Improvement Equipment – DRONELIFE


New package combines {hardware} and software program to speed up AI integration for protection, safety, and industrial purposes

Teledyne FLIR OEM has launched the Boson®+ IQ Improvement Equipment, a brand new resolution designed to hurry up the mixing of thermal imaging and synthetic intelligence (AI) on the edge. The announcement was made forward of DSEI UK 2025, one of many world’s main protection and safety exhibitions, set to happen in London from September 9 to 12.

A Complete Improvement Platform

The Boson+ IQ Improvement Equipment brings collectively reference {hardware} and Prism™ software program, giving system integrators a platform to create superior edge AI capabilities. At its core is the Teledyne FLIR OEM AVP, powered by the Qualcomm® Dragonwing™ QCS8550 system-on-chip (SoC). The SoC delivers 50 trillion operations per second (TOPS) whereas drawing solely 2.5 watts of energy.

Its multicore structure helps Prism AI object detection fashions and Prism ISP (Picture Sign Processing) options, together with denoising and tremendous decision. These capabilities guarantee clear imaging in tough environments, which is essential for protection, safety, and industrial use.

“The Boson+ IQ Dev Equipment represents a significant leap ahead for integrators constructing smarter, extra environment friendly thermal techniques on the edge with AI significantly for autonomy purposes reminiscent of aerial drones, loitering munitions, and ground-based robotics,” mentioned Jared Faraudo, vice chairman of product administration and packages, Teledyne FLIR OEM. “By combining our high-performance Boson+ thermal digital camera with Prism AI and ISP software program on a cutting-edge Qualcomm compute platform, we’re enabling quicker growth cycles, industry-best picture high quality, and longer mission endurance with minimal energy consumption.”

Versatile and Scalable Design

The event package was designed with scalability in thoughts. It contains interface and provider boards with three MIPI interfaces, permitting builders to combine seen or different sensor varieties alongside thermal cameras. To streamline growth, the bundle additionally contains the Boson+ and Prism SDKs, {hardware} interface management documentation, and entry to engineering help.

This design helps integrators transfer extra effectively from prototype to full deployment. The package’s flexibility is predicted to attraction to builders working throughout a number of sectors, from protection to industrial automation.

Future-Prepared Capabilities

The Boson+ IQ Improvement Equipment is appropriate with upcoming software program options reminiscent of Prism SKR and Prism Supervisor. Prism SKR will allow autonomous goal detection and terminal steerage. Prism Supervisor will present autonomous navigation to waypoints utilizing GPS or visual-based navigation (VBN) expertise.

These additions are anticipated to develop the package’s potential for mission-critical purposes, providing enhanced situational consciousness and autonomy in advanced environments.

Attendees at DSEI UK 2025 can see the Boson+ IQ Improvement Equipment on the Teledyne FLIR stand (#S3-110) at ExCeL London. The exhibition runs September 9–12 and is acknowledged as one of many world’s premier protection and safety occasions.

For extra info, go to Teledyne FLIR OEM.

Learn extra:



Leave a Reply

Your email address will not be published. Required fields are marked *